Technical Specifications of ESD0P2RF02LSE6327XTSA1
| Datasheet |  ESD0P2RF02LSE6327XTSA1 datasheet |
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| Product Photos | TSSLP-2 |
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| Catalog Drawings | Circuit |
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| Featured Product | Solid State RF Powered Oven Solution |
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| PCN Packaging | Recyclable Glass Carrier 14/Oct/2014 |
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| Standard Package | 15,000 |
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| Category | Circuit Protection |
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| Family | TVS - Diodes |
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| Series | - |
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| Packaging | Tape & Reel (TR) |
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| Type | Zener |
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| Unidirectional Channels | - |
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| Bidirectional Channels | 1 |
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| Voltage - Reverse Standoff (Typ) | 5.3V (Max) |
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| Voltage - Breakdown (Min) | 7V |
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| Voltage - Clamping (Max) @ Ipp | 21V |
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| Current - Peak Pulse (10/1000μs) | 3A (8/20μs) |
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| Power - Peak Pulse | - |
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| Power Line Protection | No |
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| Applications | RF Antenna |
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| Capacitance @ Frequency | 0.23pF @ 1MHz |
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| Operating Temperature | -55°C ~ 125°C (TJ) |
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| Mounting Type | Surface Mount |
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| Package / Case | 2-XFDFN |
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| Supplier Device Package | PG-TSSLP-2 |
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| Other Names | 0P2RF02LSE6327XT ESD0P2RF-02LS E6327 ESD0P2RF-02LSE6327INTR ESD0P2RF-02LSE6327INTR-ND ESD0P2RF02LSE6327 SP000516752 |
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