Technical Specifications of 510-93-145-15-002001
Datasheet | 510-93-145-15-002001 datasheet |
Category | Connectors, Interconnects |
Family | Sockets for ICs, Transistors |
Manufacturer | Mill-Max Manufacturing Corp. |
Series | 510 |
Packaging | Bulk |
Type | PGA |
Number of Positions or Pins (Grid) | 145 (15 x 15) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 30μin (0.76μm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | - |
Contact Finish Thickness - Post | - |
Contact Material - Post | Brass Alloy |
Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Operating Temperature | -55°C ~ 125°C |
Termination Post Length | 0.125" (3.18mm) |
Material Flammability Rating | - |
Current Rating | 3A |
Contact Resistance | - |
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