Technical Specifications of UPD70F3529GMA9-GBK-G
| Category | Integrated Circuits (ICs) |
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| Family | Embedded - Microcontrollers |
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| Manufacturer | Renesas Electronics America |
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| Series | V850E2/Dx4-H |
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| Packaging | Tray |
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| Part Status | Active |
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| Core Processor | V850E2M |
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| Core Size | 32-Bit |
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| Speed | 80MHz |
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| Connectivity | CAN, CSI, I2C, LIN, SPI, UART/USART |
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| Peripherals | DMA, I2S, LCD, LVD, POR, PWM, WDT |
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| Number of I/O | 127 |
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| Program Memory Size | 2GB (2G x 8) |
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| Program Memory Type | FLASH |
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| EEPROM Size | 32K x 8 |
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| RAM Size | 96K x 8 |
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| Voltage - Supply (Vcc/Vdd) | 2.7 V ~ 5.5 V |
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| Data Converters | A/D 12x10b, A/D 12x12b |
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| Oscillator Type | Internal |
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| Operating Temperature | -40°C ~ 105°C (TA) |
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| Package / Case | 176-LQFP Exposed Pad |
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| Supplier Device Package | 176-HLQFP (24x24) |
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